Laser Cutting Silicon Wafers,Breaking Taps



Micromachining silicon with lasers (but no sharks)! Today we’re exploring different properties and parameters involved with cutting silicon with a pulsed nanosecond laser

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==== Links ====
– Photon sieve design is from: Andersen, Geoff, and Drew Tullson. “Broadband antihole photon sieve telescope.” Applied optics 46.18 (2007): 3706-3708.
– Experimental watch oscillator is from: Thalmann, Etienne, et al. “Flexure pivot oscillator with intrinsically tuned isochronism.” Journal of Mechanical Design 142.7 (2020): 075001.
– Big watch flexure is from:

Some videos about nanosecond etching, cutting, drilling:

==== Timeline ====
0:00 Nanosecond laser
1:00 Why silicon?
1:46 Examples
2:32 Tip #1: Polished vs unpolished side
3:10 Tip #2: Focal length
4:00 Tip #3: Heat management
4:40 Confounding variables
5:23 My Best Recipe
5:43 Wobble
7:16 Cut geometry
8:12 Supported vs unsupported
8:57 How good is surface finish?
11:05 Taper in microholes
11:54 2.5D/3D engraving
12:05 Etching interference fringes and fingerprints
12:28 Metal?
12:57 Ultrafast sintering!

Breaking Taps

#Laser #Cutting #Silicon #Wafers