What are the advantages of laser cutting PI film?

PI film, namely polyimide film, is called “golden film” because of its amber color, excellent performance and expensive price. It is one of the best film insulating materials in the world at present and is considered to be one of the most promising engineering plastics in the 21st century because of its excellent physical and chemical properties. With the arrival of 5G era, the increase of power consumption of electronic products and the upgrading of structural design, driven by the demand of downstream markets, high-performance PI films have been widely used in flexible circuit boards, consumer electronics, high-speed rail transit, wind power generation, new energy vehicles, 5G communications, flexible display, aerospace and other national strategic emerging industries.
In recent years, with the rapid growth of the demand for on-board FPC, the rapid rise of emerging consumer electronics markets such as wearable intelligent devices has brought new growth space for FPC products. FPC is a kind of flexible printed circuit board with excellent reliability, which is made of polyimide or polyester film as the base material. It is generally made of FCCL by bonding copper foil and PI film, and soft board is made of covering film, reinforcing plate, anti-static layer and other materials. FCCL is the key substrate for the production of FPC, and electronic grade PI film is its core raw material. With the rapid growth of electronic grade applications such as FPC and flexible substrate, the demand for electronic grade PI film will further increase.
Due to the high technical barriers of PI film, its R&D and manufacturing technologies have been mainly monopolized by American, Japanese and Korean enterprises for a long time. In recent years, China has accumulated a certain amount of R&D and technical personnel in the film industry. The R&D level of PI membrane products in China is still improving, with the continuous refinement of new industry and new function requirements. The research and application in some fields have reached the world’s advanced level.
Laser, the “sharpest knife”, meets the high requirements of modern science and technology for PI film cutting. What are the advantages of laser cutting machine for PI film cutting?
1. High precision flying light path design (high cutting accuracy, good seam quality, small seam, almost no material loss);
2. Automatic feeding device (save time cost, save time cost, no manual operation, more efficient);
3. CCD automatic positioning (CCD searches the target and can locate large and small pieces with 3um accuracy);
4. High stable output laser generator (with imported light source precision optical design, non-contact processing, fine spot, high cutting accuracy and good effect);
5. No carbonization on the cross section (small laser pulse width, small carbonization range, no carbonization on basic vision);
6. Cutting and drilling effect (single pulse energy is used during processing, high-frequency processing makes the processing surface more fine and smooth);